Conference Information


The Fifth International Conference on Technological Advances in Electrical, Electronics and Computer Engineering (TAEECE2017)


The Fifth International Conference on Technological Advances in Electrical, Electronics and Computer Engineering (TAEECE2017), Kuala Lumpur, Malaysia
Conference Title
The Fifth International Conference on Technological Advances in Electrical, Electronics and Computer Engineering (TAEECE2017)
Event Type
Conference
Conference Date
11-07-2017 to 13-07-2017
Last Date for Applying
11-06-2017
Location
Kuala Lumpur, Malaysia

Publish / Maintain / Marketing / Hosted By
Organization Name / Organize By
The Society of Digital Information and Wireless Communications (SDIWC)
Sponsored By
The Society of Digital Information and Wireless Communications (SDIWC)
Organizing/Related Departments
I.T, Computer Science, Engineering
Organization Type
Organization
Conference Category
Both (Technical & Non Technical)
Conference Level
International
Related Industries

Engineering

Computer Science

Computer/Technology

Location
Kuala Lumpur, Malaysia

The Fifth International Conference on Technological Advances in Electrical, Electronics and Computer Engineering (TAEECE2017)

You are invited to this conference on July 11-13, 2017. The event will be held over three days, with presentations delivered by researchers from the international community, including presentations from keynote speakers and state-of-the-art lectures.

PAPERS

The conference welcomes papers on the following (but not limited to) research topics:

Electronics Engineering

  • 3D Semiconductor Device Technology
  • Adaptive Signal Processing
  • Advanced Electromagnetics
  • Mobile Computing
  • Mobile Robotics
  • Artificial Intelligence
  • Component Technology of MEMS

 Electrical Engineering

  • Software Specification
  • Circuits and Electronics
  • Electric Energy Processing
  • Analog Circuits and Digital Circuits
  • Battery Management System
  • Computer Relaying

Computer Engineering

  • Algorithms
  • Automated Software Engineering
  • Computer-aided Design
  • Computer Architecture
  • Computer Modelling
  • Data Encryption
  • Expert Systems

and many more...

SUBMISSION IS OPEN until June 11, 2017

All registered papers will be published in SDIWC Digital Library.

Should you have any queries, please visit the conference web page or send us email at taeece17@sdiwc.net

Others Details

For more details and updates please visit website

Registration Fees
Available
Registration Fees Details
Visit website
Registration Ways
Website
Address/Venue
Asia Pacific University of Technology and Innovation (APU), Technology Park Malaysia, Bukit Jalil, 57000 Kuala Lumpur, Wilayah Persekutuan Kuala Lumpur, Malaysia 
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